Low Dielectric PEEK
When considering a plastic to use for electronics packaging, a low dielectric constant is key. Delnova Materials Low Dielectric PEEK is modified to have a dielectric constant of 2.72, while still retaining the characteristic chemical and thermal stability of PEEK plastics. This material is a perfect choice for any electronics packaging that requires the reliable performance of PEEK.
Key Advantages:
- The dielectric constant of Low-Dielectric PEEK is 2.72.
- The dielectric loss constant of Low-Dielectric PEEK is less than 0.0025.
- Low-Dielectric PEEK has a continuous use temperature up to 260 °C.
- Low-Dielectric PEEK has excellent processing performance.
- Low-Dielectric PEEK can be injection molded, extruded, and processed via other molding methods.
Material Properties:
| Specification |
Measurement |
| Density |
1.28 g/cm3 |
| Shrinkage |
0.80 % |
| Degree of Crystallization |
30 % |
| Water Absorption |
0.05 % |
| Tensile Strength |
95 MPa |
| Tensile Modulus |
- |
| Bending Strength |
170 Mpa |
| Flexural Modulus |
- |
| Compressive Strength |
240 MPa |
| Elongation at Break |
4.5 % |
| Continuous Use Temperature |
260 °C |
| Heat Deflection Temperature |
186 °C |
| Volume Electric Resistivity |
- |
| Dielectric Loss |
0.0025 |
| Dielectric Constant |
2.72 |
| Rockwell Hardness |
85 |